Electronic Device with Display Chassis Structures

ABSTRACT

Electronic devices may include displays. A display may include backlight components that provide backlight illumination for the display. Backlight components may include a light guide plate that distributes light from a light source across the display. Display chassis structures may be used to support display layers and backlight components. A metal chassis may include a portion that partially surrounds the light source. Openings or perforations in the metal chassis may allow the portion that surrounds the light source to flex about a flex axis. A portion of a display layer may be mounted to a plastic chassis. The plastic chassis may be insert molded over a light source, may form part of a package for a light source, may be adhered to a light source, or may wrap around the light source. An encapsulant may be formed over the light source to protect the light source from vibrations and contaminants.

This application is a division of U.S. patent application Ser. No.13/673,808, filed on Nov. 9, 2012, which is hereby incorporated byreference herein in its entirety. This application claims the benefit ofand claims priority to U.S. patent application Ser. No. 13/673,808,filed on Nov. 9, 2012.

BACKGROUND

This relates generally to electronic devices, and more particularly, toelectronic devices with displays.

Electronic devices often include displays. For example, cellulartelephones and portable computers often include displays for presentinginformation to a user. An electronic device may have a housing such as ahousing formed from plastic or metal. Components for the electronicdevice such as display components may be mounted in the housing.

It can be challenging to incorporate a display into the housing of anelectronic device. Size, weight, electrical grounding, robustness, easeof assembly, and light-tightness are often important considerations indesigning electronic devices. If care is not taken, displays may bebulky, may exhibit undesired light reflections, or may be prone todamage during a drop event. The housing of an electronic device can beadjusted to accommodate a bulky display with large borders, but this canlead to undesirable enlargement of the size and weight of the housingand unappealing device aesthetics.

It would therefore be desirable to be able to provide improved ways toprovide displays for electronic devices.

SUMMARY

An electronic device may be provided with a display. The display mayhave display layers for displaying images. Backlight structures may beincluded in the display. The backlight structures may provide backlightthat illuminates the display layers in the display that are displayingan image for a user.

Display chassis structures may be used to support display layers andbacklight structures. The display chassis structures may include a metaldisplay chassis and a plastic display chassis.

The metal display chassis may include a planar portion and a bentportion. The bent portion may partially surround a light source. Flexpromotion features may be formed in the bent portion to allow the bentportion of the metal display chassis to flex around one or more flexaxes. The flex promotion features may include openings or perforations.An opaque film may be used to cover the openings so that light isprevented from passing through the openings.

A light source may emit light into the edge of a light guide plate in adisplay. The light source may include a semiconductor device mounted ona lead frame structure. A wire bond may electrically couple thesemiconductor device to the lead frame structure. The lead framestructure may be mounted on a flexible printed circuit substrate usingsolder. A plastic package may be molded over the semiconductor deviceand lead frame structure.

A plastic display chassis on which a portion of a display layer ismounted may be insert molded over the light source. An encapsulant maybe formed over the light source to protect the light source fromvibrations and contaminants. The encapsulant may include pottingmaterial.

A plastic display chassis on which a portion of a display layer ismounted may form part of a package for a light source. The plasticdisplay chassis may be injection molded over at least some of thelight-emitting diode and lead frame structure that form the lightsource.

A light source may be mounted on a printed circuit substrate. Theprinted circuit substrate may be attached to a metal display chassisusing adhesive.

Further features of the invention, its nature and various advantageswill be more apparent from the accompanying drawings and the followingdetailed description of the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an illustrative electronic device suchas a laptop computer with a display in accordance with an embodiment ofthe present invention.

FIG. 2 is a perspective view of an illustrative electronic device suchas a handheld electronic device with a display in accordance with anembodiment of the present invention.

FIG. 3 is a perspective view of an illustrative electronic device suchas a tablet computer with a display in accordance with an embodiment ofthe present invention.

FIG. 4 is a schematic diagram of an illustrative electronic device witha display in accordance with an embodiment of the present invention.

FIG. 5 is a cross-sectional side view of an illustrative display inaccordance with an embodiment of the present invention.

FIG. 6 is a cross-sectional side view of illustrative display layers andbacklight structures in accordance with an embodiment of the presentinvention.

FIG. 7 is a perspective view of a light guide plate and correspondingchassis structure in accordance with an embodiment of the presentinvention.

FIG. 8 is a cross-sectional side view of illustrative display layers,backlight structures, and chassis structures in accordance with anembodiment of the present invention.

FIG. 9 is a perspective view of a metal display chassis having flexpromotion features such as openings in accordance with an embodiment ofthe present invention.

FIG. 10 is a perspective view of a metal display chassis having flexpromotion features such as perforations in accordance with an embodimentof the present invention.

FIG. 11 is a perspective view of a metal display chassis that has beenpartially covered with an opaque layer of film in accordance with anembodiment of the present invention.

FIG. 12 is a cross-sectional side view of an illustrative display inwhich a plastic display chassis has been insert molded over alight-emitting diode package in accordance with an embodiment of thepresent invention.

FIG. 13 is a cross-sectional side view of an illustrative display inwhich a plastic display chassis has been insert molded over alight-emitting diode package and in which an encapsulant has been formedover the light-emitting diode package in accordance with an embodimentof the present invention.

FIG. 14 is a cross-sectional side view of an illustrative display inwhich a plastic display chassis wraps around a light source and attachesto a metal display chassis in accordance with an embodiment of thepresent invention.

FIG. 15 is a cross-sectional side view of an illustrative display inwhich a plastic display chassis forms at least part of a package for alight-emitting diode in accordance with an embodiment of the presentinvention.

FIG. 16 is a cross-sectional side view of an illustrative display inwhich a plastic display chassis is adhered to a light-emitting diodepackage using adhesive in accordance with an embodiment of the presentinvention.

DETAILED DESCRIPTION

Electronic devices may include displays. The displays may be used todisplay images to a user. Illustrative electronic devices that may beprovided with displays are shown in FIGS. 1, 2, and 3.

FIG. 1 shows how electronic device 10 may have the shape of a laptopcomputer having upper housing 12A and lower housing 12B with componentssuch as keyboard 16 and touchpad 18. Device 10 may have hinge structures20 that allow upper housing 12A to rotate in directions 22 aboutrotational axis 24 relative to lower housing 12B. Display 14 may bemounted in upper housing 12A. Upper housing 12A, which may sometimesreferred to as a display housing or lid, may be placed in a closedposition by rotating upper housing 12A towards lower housing 12B aboutrotational axis 24.

FIG. 2 shows how electronic device 10 may be a handheld device such as acellular telephone, music player, gaming device, navigation unit, orother compact device. In this type of configuration for device 10,housing 12 may have opposing front and rear surfaces. Display 14 may bemounted on a front face of housing 12. Display 14 may, if desired, havea display cover layer or other exterior layer that includes openings forcomponents such as button 26. Openings may also be formed in a displaycover layer or other display layer to accommodate a speaker port (see,e.g., speaker port 28 of FIG. 2).

FIG. 3 shows how electronic device 10 may be a tablet computer. Inelectronic device 10 of FIG. 3, housing 12 may have opposing planarfront and rear surfaces. Display 14 may be mounted on the front surfaceof housing 12. As shown in FIG. 3, display 14 may have a cover layer orother external layer with an opening to accommodate button 26 (as anexample).

The illustrative configurations for device 10 that are shown in FIGS. 1,2, and 3 are merely illustrative. In general, electronic device 10 maybe a laptop computer, a computer monitor containing an embeddedcomputer, a tablet computer, a cellular telephone, a media player, orother handheld or portable electronic device, a smaller device such as awrist-watch device, a pendant device, a headphone or earpiece device, orother wearable or miniature device, a television, a computer displaythat does not contain an embedded computer, a gaming device, anavigation device, an embedded system such as a system in whichelectronic equipment with a display is mounted in a kiosk or automobile,equipment that implements the functionality of two or more of thesedevices, or other electronic equipment.

Housing 12 of device 10, which is sometimes referred to as a case, maybe formed of materials such as plastic, glass, ceramics, carbon-fibercomposites and other fiber-based composites, metal (e.g., machined orcast aluminum, stainless steel, or other metals), other materials, or acombination of these materials. Device 10 may be formed using a unibodyconstruction in which most or all of housing 12 is formed from a singlestructural element (e.g., a piece of machined metal or a piece of moldedplastic) or may be formed from multiple housing structures (e.g., outerhousing structures that have been mounted to internal frame elements orother internal housing structures).

Display 14 may be a touch sensitive display that includes a touch sensoror may be insensitive to touch. Touch sensors for display 14 may beformed from an array of capacitive touch sensor electrodes, a resistivetouch array, touch sensor structures based on acoustic touch, opticaltouch, or force-based touch technologies, or other suitable touch sensorcomponents.

Displays for device 10 may, in general, include image pixels formed fromlight-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells,electrowetting pixels, electrophoretic pixels, liquid crystal display(LCD) components, or other suitable image pixel structures. In somesituations, it may be desirable to use LCD components to form display14, so configurations for display 14 in which display 14 is a liquidcrystal display are sometimes described herein as an example. It mayalso be desirable to provide displays such as display 14 with backlightstructures, so configurations for display 14 that include a backlightunit may sometimes be described herein as an example. Other types ofdisplay technology may be used in device 10 if desired. The use ofliquid crystal display structures and backlight structures in device 10is merely illustrative.

A display cover layer may cover the surface of display 14 or a displaylayer such as a color filter layer or other portion of a display may beused as the outermost (or nearly outermost) layer in display 14. Adisplay cover layer or other outer display layer may be formed from atransparent glass sheet, a clear plastic layer, or other transparentmember.

Touch sensor components such as an array of capacitive touch sensorelectrodes formed from transparent materials such as indium tin oxidemay be formed on the underside of a display cover layer, may be formedon a separate display layer such as a glass or polymer touch sensorsubstrate, or may be integrated into other display layers (e.g.,substrate layers such as a thin-film transistor layer).

A schematic diagram of an illustrative configuration that may be usedfor electronic device 10 is shown in FIG. 4. As shown in FIG. 4,electronic device 10 may include control circuitry 29. Control circuitry29 may include storage and processing circuitry for controlling theoperation of device 10. Control circuitry 29 may, for example, includestorage such as hard disk drive storage, nonvolatile memory (e.g., flashmemory or other electrically-programmable-read-only memory configured toform a solid state drive), volatile memory (e.g., static or dynamicrandom-access-memory), etc. Control circuitry 29 may include processingcircuitry based on one or more microprocessors, microcontrollers,digital signal processors, baseband processors, power management units,audio codec chips, application specific integrated circuits, etc.

Control circuitry 29 may be used to run software on device 10, such asoperating system software and application software. Using this software,control circuitry 29 may present information to a user of electronicdevice 10 on display 14. When presenting information to a user ondisplay 14, sensor signals and other information may be used by controlcircuitry 29 in making adjustments to the strength of backlightillumination that is used for display 14.

Input-output circuitry 30 may be used to allow data to be supplied todevice 10 and to allow data to be provided from device 10 to externaldevices. Input-output circuitry 30 may include communications circuitry32. Communications circuitry 32 may include wired communicationscircuitry for supporting communications using data ports in device 10.Communications circuitry 32 may also include wireless communicationscircuits (e.g., circuitry for transmitting and receiving wirelessradio-frequency signals using antennas).

Input-output circuitry 30 may also include input-output devices 34. Auser can control the operation of device 10 by supplying commandsthrough input-output devices 34 and may receive status information andother output from device 10 using the output resources of input-outputdevices 34.

Input-output devices 34 may include sensors and status indicators 36such as an ambient light sensor, a proximity sensor, a temperaturesensor, a pressure sensor, a magnetic sensor, an accelerometer, andlight-emitting diodes and other components for gathering informationabout the environment in which device 10 is operating and providinginformation to a user of device 10 about the status of device 10.

Audio components 38 may include speakers and tone generators forpresenting sound to a user of device 10 and microphones for gatheringuser audio input.

Display 14 may be used to present images for a user such as text, video,and still images. Sensors 36 may include a touch sensor array that isformed as one of the layers in display 14.

User input may be gathered using buttons and other input-outputcomponents 40 such as touch pad sensors, buttons, joysticks, clickwheels, scrolling wheels, touch sensors such as sensors 36 in display14, key pads, keyboards, vibrators, cameras, and other input-outputcomponents.

A cross-sectional side view of an illustrative configuration that may beused for display 14 of device 10 (e.g., for display 14 of the devices ofFIG. 1, FIG. 2, or FIG. 3 or other suitable electronic devices) is shownin FIG. 5. As shown in FIG. 5, display 14 may include one or more layersof touch sensitive components such as touch-sensitive layers 47 that areattached to a cover layer such as cover layer 49. Cover layer 49 may beformed from a sheet of rigid or flexible transparent material such asglass or plastic.

Touch-sensitive layers 47 may be attached to cover layer 49 using anadhesive material such as optically clear adhesive (OCA) 43. Adhesive 43may be liquid adhesive, light-cured adhesive, pressure-sensitiveadhesive or other suitable adhesive. Touch-sensitive layers 47 mayinclude touch sensor components such as an array of capacitive touchsensor electrodes formed from transparent materials such as indium tinoxide.

Display 14 may include display layers such as layers 46 for generatingimages to be displayed on display 14. Display layers 46 may includepolarizer layers, color filter layers, transistor layers, adhesivelayers, layers of liquid crystal material, or other layers forgenerating display images. Display layers 46 may be attached totouch-sensitive layers 43 using adhesive such as optically clearadhesive 45. Adhesive 45 may be liquid adhesive, light-cured adhesive,pressure-sensitive adhesive or other suitable adhesive.

Display layers 46 may use light generated by light-generating structuressuch as backlight structures 42 to form images to be viewed by a user ofdevice 10. Backlight structures 42 may include light-generatingcomponents such as light-emitting diodes, light guiding structures,reflective structures, optical films, etc. Backlight structures 42 maybe attached to display layers 46 or may be mounted adjacent to layers 46by attaching backlight structures 42 to one or more structural members.

A cross-sectional side view of an illustrative configuration that may beused for display layers 46 and backlight structures 42 of display 14(e.g., for display layers 46 and backlight structures 42 of the displayof FIG. 5, or other suitable display) is shown in FIG. 6. As shown inFIG. 6, display 14 may include backlight structures such as backlightunit 42 for producing backlight 44. During operation, backlight 44travels outwards (vertically upwards in dimension Z in the orientationof FIG. 6) and passes through display pixel structures in display layers46. This illuminates any images that are being produced by the displaypixels for viewing by a user. For example, backlight 44 may illuminateimages on display layers 46 that are being viewed by viewer 48 indirection 50.

Display layers 46 may be mounted in chassis structures such as a plasticchassis structure and/or a metal chassis structure to form a displaymodule for mounting in housing 12 or display layers 46 may be mounteddirectly in housing 12 (e.g., by stacking display layers 46 into arecessed portion in housing 12). Display layers 46 may form a liquidcrystal display or may be used in forming displays of other types.

In a configuration in which display layers 46 are used in forming aliquid crystal display, display layers 46 may include a liquid crystallayer such a liquid crystal layer 52. Liquid crystal layer 52 may besandwiched between display layers such as display layers 58 and 56.Layers 56 and 58 may be interposed between lower polarizer layer 60 andupper polarizer layer 54. If desired, upper polarizer layer 54 may beattached to an outer cover layer such as cover layer 49 (FIG. 5).

Layers 58 and 56 may be formed from transparent substrate layers such asclear layers of glass or plastic. Layers 56 and 58 may be layers such asa thin-film transistor layer and/or a color filter layer. Conductivetraces, color filter elements, transistors, and other circuits andstructures may be formed on the substrates of layers 58 and 56 (e.g., toform a thin-film transistor layer and/or a color filter layer). Touchsensor electrodes may also be incorporated into layers such as layers 58and 56 and/or touch sensor electrodes may be formed on other substrates.

With one illustrative configuration, layer 58 may be a thin-filmtransistor layer that includes an array of thin-film transistors andassociated electrodes (display pixel electrodes) for applying electricfields to liquid crystal layer 52 and thereby displaying images ondisplay 14. Layer 56 may be a color filter layer that includes an arrayof color filter elements for providing display 14 with the ability todisplay color images. If desired, layer 58 may be a color filter layerand layer 56 may be a thin-film transistor layer.

During operation of display 14 in device 10, control circuitry 29 (e.g.,one or more integrated circuits such as components 68 on printed circuit66 of FIG. 6) may be used to generate information to be displayed ondisplay (e.g., display data). The information to be displayed may beconveyed from circuitry 68 to display driver integrated circuit 62 usinga signal path such as a signal path formed from conductive metal tracesin flexible printed circuit 64 (as an example).

Display driver integrated circuit 62 may be mounted on thin-filmtransistor layer driver ledge 82 or elsewhere in device 10. A flexibleprinted circuit cable such as flexible printed circuit 64 may be used inrouting signals between printed circuit 66 and thin-film transistorlayer 58. If desired, display driver integrated circuit 62 may bemounted on printed circuit 66 or flexible printed circuit 64.

Printed circuit 66 may be formed from a rigid printed circuit board(e.g., a layer of fiberglass-filled epoxy) or a flexible printed circuit(e.g., a flexible sheet of polyimide or other flexible polymer layer).However, these examples are merely illustrative. If desired printedcircuits 64 and 66 may be formed from a combination of rigid andflexible printed circuit layers (e.g., printed circuit 66 may be formedfrom a rigid printed circuit board with a layer of flexible printedcircuitry that extends from an edge of printed circuit 66 to formflexible printed circuitry 64 that attaches to thin-film transistorlayer 58).

Backlight structures 42 may include a backlight light guide plate suchas light guide plate 78. Light guide plate 78 may be formed from atransparent material such as clear glass or plastic. During operation ofbacklight structures 42, a light source such as light source 72 maygenerate light 74. Light source 72 may be, for example, an array oflight-emitting diodes.

Light 74 from light source 72 may be coupled into edge surface 76 oflight guide plate 78 and may be distributed laterally in dimensions Xand Y throughout light guide plate 78 due to the principal of totalinternal reflection. Light guide plate 78 may include light-scatteringfeatures such as pits or bumps or other light-scattering structures. Thelight-scattering features may be located on an upper surface and/or onan opposing lower surface of light guide plate 78.

Light 74 that scatters upwards in direction Z from light guide plate 78may serve as backlight 44 for display 14. Light 74 that scattersdownwards may be reflected back in the upwards direction by reflector80. Reflector 80 may be formed from a reflective material such as alayer of white plastic or other shiny materials.

To enhance backlight performance for backlight structures 42, backlightstructures 42 may include optical films 70. Optical films 70 may includediffuser layers for helping to homogenize backlight 44 and therebyreduce hotspots, compensation films for enhancing off-axis viewing, andbrightness enhancement films (also sometimes referred to as turningfilms) for collimating backlight 44. Optical films 70 may overlap theother structures in backlight unit 42 such as light guide plate 78 andreflector 80. For example, if light guide plate 78 has a rectangularfootprint in the X-Y plane of FIG. 6, optical films 70 and reflector 80may have a matching rectangular footprint.

Display structures such as light guide plate 78 may be mounted in asupport structure such as display chassis 90 of FIG. 7. Display chassis90 may include plastic chassis structures and metal chassis structures.Display chassis 90 may serve as an interface between the structures ofdisplay 14 and surrounding portions of housing 12. If desired, displaychassis 90 may include a ring of plastic (e.g., a plastic ring with athickness of about 0.2 to 1.5 mm, as an example) or may be formed from aplate of material that includes a rectangular recess to accommodatedisplay structures such as light guide plate 78. Chassis structure 90may be formed from housing structures (e.g., as part of a housing frame,part of a unibody housing such as a metal housing, etc.).

The arrangement of FIG. 7 in which chassis structure 90 surrounds lightguide plate 78 and is formed from a single contiguous structure ismerely illustrative. If desired, chassis structure 90 may only partiallysurround light guide plate 78, may be formed from multiple structures,and/or may be formed from different materials.

An illustrative arrangement in which display 14 is mounted in a chassisstructure that includes multiple parts formed from different materialsis shown in FIG. 8. As shown in FIG. 8, chassis structure 90 may includea plastic display chassis such as plastic chassis member 90P (sometimesreferred to as a p-chassis) and a metal display chassis such as metalchassis member 90M (sometimes referred to as an m-chassis). Plasticchassis member 90P and metal chassis member 90M may each be formed froma single structure or may each include multiple parts.

Display structures such as display layers 46 may be mounted on a planarportion such as portion 91 of plastic chassis 90P. An adhesive such asadhesive 92 may be used in attaching an interior layer of display layers46 such as lower polarizer 60 to planar surface 91 of plastic chassis90P. Adhesive 92 may be liquid adhesive, light-cured adhesive,pressure-sensitive adhesive, or other suitable adhesive. If desired,adhesive 92 may be optically clear adhesive.

Plastic chassis 90P may have a protruding portion such as protrudingportion 93 that extends between some of display layers 46 and lightguide plate 78. Adhesive such as adhesive 84 may be used in attachinglight guide plate 78 to the underside of protruding portion 93 ofplastic chassis 90P. A display layer such as display layer 58 may beattached to plastic chassis 90P using an adhesive such as adhesive 51.Adhesives 51 and 84 may be liquid adhesives, light-cured adhesives,pressure-sensitive adhesives, or other suitable adhesives. If desired,adhesives 51 and 84 may be optically clear adhesives.

Plastic chassis 90P may be formed from materials such as polycarbonate,polycarbonate acrylonitrile butadiene styrene (PC-ABS), nylon,glass-filled polycarbonate, glass-filled nylon, silicone, or othersuitable materials. Using a glass-reinforced plastic may lower thethermal expansion coefficient of chassis 90P. Chassis 90P may includeany suitable amount of glass fibers (e.g., 10%, 20%, 30%, 40%, or othersuitable amount of glass). If desired, chassis 90 may contain asufficient amount of glass to lower the thermal expansion coefficient toa desired level without causing chassis 90P to be excessively rigid. Ifdesired, chassis 90P may be free of glass fibers. The example in whichchassis 90P is formed from glass-filled polycarbonate (e.g., alow-glass-filled polycarbonate) is merely illustrative.

Features such as low coefficient of thermal expansion and low rigiditymay ensure that chassis 90P provides structural support for display 14without inducing undesired stress on display 14. For example, thethermal expansion coefficient of chassis 90P may be matched to that ofother structures in device 10 such as device housing structures (e.g.,housing 12 of FIGS. 1, 2, and 3). This may ensure that chassis 90P andthe surrounding structures such as housing 12 expand at similar rateswhen device 10 heats up.

Chassis 90P may be provided with other features that may help minimizemechanical stress on display 14. For example, chassis 90P may have aminimized footprint in the

X-Y plane. Wall sections such as wall section 95 of chassis 90P may, forexample, have a width W of about 0.1 mm, 0.2 mm, 0.3 mm, less than 0.3mm, more than 0.3 mm, etc.

Chassis structure 90P may be molded (e.g., using an injection moldingprocess or other suitable molding process), machined, thermoformed, ormay be formed using any other suitable fabrication process. Plasticchassis 90P may, for example, be injection molded over metal chassis 90M(e.g., at the corners of device 10 or at other suitable locations indevice 10). In the example of FIG. 8, plastic chassis 90P is attached tometal chassis 90M at location 89.

Metal chassis 90M may be formed from stainless steel sheet metal orother suitable materials. Chassis 90M may have a planar portion such asportion 97 that overlaps light guide plate 78 and a bent portion such asportion 99 that wraps around an edge portion of light guide plate 78(e.g., using a C-shaped wrap). As shown in FIG. 8, backlight structuresmay be mounted in c-shaped portion 99 of chassis 90M. For example,light-emitting diodes 72 may be mounted on a substrate such as substrate88. Light-emitting diodes 72 and substrate 88 may be mounted withinc-shaped portion 99 of chassis 90M (e.g., light-emitting diodes 72 andsubstrate 88 may be interposed between upper and lower layers of metalchassis 90M). Substrate 88 may be formed from a rigid printed circuitboard material (e.g., fiberglass-filled epoxy material such as FR4) or aflexible printed circuit substrate material such as polyimide or a sheetof other flexible polymer. Substrate 88 may be mounted on planar portion97 of chassis 90M.

As shown in FIG. 8, reflector 80 may be interposed between metal chassis90M and light guide plate 78. Reflector 80 may be attached to plasticchassis 90P using an adhesive such as adhesive 86 (e.g., a pressuresensitive or other suitable adhesive).

Metal chassis 90M may be provided with features that may help minimizemechanical stress on display 14. For example, as shown in FIG. 9,chassis 90M may include flex promotion features such as flex promotionfeatures 100. Flex promotion features 100 may include holes, openings,notches, or perforations in curved portion 99 of chassis 90M. Flexpromotion features 100 may allow chassis 90 to flex slightly around flexaxes 102 and 104. Flex promotion features 100 may be formed using anysuitable metalworking process (e.g., chemical etching, perforating,coining, stamping, other suitable methods, etc.).

As shown in FIG. 9, flex promotion features 100 may be formed alongc-shaped portion 99. Flex promotion features 100 may be formed locallyat the bend in chassis 99. If desired, flex promotion features 100 mayextend into planar portion 97, as shown by portion 106 of opening 100.

In the example of FIG. 9, flex promotion features 100 are each formed asan elongated opening that is contiguous throughout the c-shape. This is,however, merely illustrative. If desired, flex promotion features 100may have an arrangement of the type shown in FIG. 10. As shown in FIG.10, flex promotion features 100 may each be formed as multiple openingsin chassis 90M. For example, flex promotion features 100 may includeperforations formed along curved portion 99 of chassis 90M.

The examples of FIGS. 9 and 10 in which openings 100 have rounded shapesare merely illustrative. In general, openings 100 may have any suitableshape (triangular, rectangular, rectilinear, circular, thin lines,etc.).

If desired, a blackout layer may be used to prevent light from escapingthrough openings 100. FIG. 11 shows an illustrative arrangement in whicha blackout layer such as blackout layer 85 is formed over openings 100(e.g., on an exterior surface of chassis 90M). Blackout layer 85 may beformed from an optically opaque film or adhesive (e.g., Mylar® film,other polyester film, other optically opaque adhesives or tapes, etc.).Blackout layer 85 may, for example, be formed from a layer of blackpolyester film having a thickness T of 20-30 microns. If desired, opaquelayer 85 may be laminated to the exterior surface of chassis 90M.

In the example of FIG. 11, blackout layer 85 is formed as a contiguouslayer that covers openings 100 in chassis 90M. This is, however, merelyillustrative. If desired, optically opaque layer 85 may include separateportions that are localized to cover individual openings 100 in chassis90M.

Flex promotion features 100 of FIGS. 9 and 10 may help reduce therigidity of chassis 90M while still allowing chassis 90M to providestructural support for display 14. If desired, bent portion 99 of metalchassis 90M may be omitted. An illustrative arrangement in which metalchassis 90M does not include c-shaped portion 99 is shown in FIG. 12.

As shown in FIG. 12, metal chassis 90M includes planar portion 97 whichoverlaps light guide plate 78. In the example of FIG. 12, metal chassis90M does not include a c-shaped portion that wraps around light-emittingdiodes 72.

Substrate 88 and light-emitting diodes 72 (sometimes collectivelyreferred to as a “light bar”) may be mounted on planar surface 97 ofmetal chassis 90M. If desired, an adhesive such as adhesive 108 may beused in attaching substrate 88 to sheet metal 90M. Adhesive 108 may bepressure-sensitive adhesive or other suitable adhesive. If desired,other mounting mechanisms may be used to mount substrate 88 to sheetmetal 90M. Using an adhesive such as adhesive 108 is merelyillustrative.

Light-emitting diodes 72 may each contain a semiconductor device thatemits light. The semiconductor device in each diode may be mounted onlead frame structures in a molded plastic package such as molded plasticpackage 72P. In order to provide planar surface 91 on which displaylayers 46 are mounted, plastic chassis 90P may be insert molded (e.g.,injection molded) over light-emitting diode packaging 72P. This type ofconfiguration may help minimize mechanical stress on display 14.

Another suitable embodiment in which metal chassis 90M does not includea bent portion that wraps around light-emitting diodes 72 is shown inFIG. 13. The arrangement shown in FIG. 13 is similar to the arrangementof FIG. 12 in that plastic chassis 90P is molded over light-emittingdiodes 72.

In the example of FIG. 13, an encapsulant such as encapsulant material94 may be formed over light-emitting diodes 72 (e.g., encapsulant 94 maybe interposed between light-emitting diodes 72 and plastic chassis 90P).Encapsulant material 94 may be formed from potting material or may beformed from other suitable low pressure molding materials. Examples ofmaterials that may be used for encapsulant 94 include epoxy, silicone,polyurethane, polyamide, other suitable materials, a combination ofthese materials, etc. Potting or encapsulating light-emitting diodes 72may provide protection for light-emitting diodes 72 during molding ofplastic chassis 90P over light-emitting diodes 72. Encapsulant 94 mayalso provide protection for light-emitting diodes 72 after device 10 hasbeen fully assembled. For example, encapsulant 94 may protectlight-emitting diodes 72 from dust, dirt, moisture, and vibration.

Another suitable embodiment in which metal chassis 90M does not includea bent portion that wraps around light-emitting diodes 72 is shown inFIG. 14. As shown in FIG. 14, plastic chassis 90P may have a planarportion such as planar portion 91 on which display layers 46 aremounted. Plastic chassis 90P may also have a bent portion such as bentportion 110 that wraps around light-emitting diodes 72 and attaches tometal chassis 90M.

Plastic chassis 90P may, for example, be injection molded over metalchassis 90, thereby forming a tightly sealed mechanical bond atinterface 96. This is, however, merely illustrative. If desired, plasticchassis 90P may be molded and then subsequently attached at interface 96using an adhesive (e.g., a pressure-sensitive adhesive or other suitableadhesive). The arrangement of FIG. 14 may provide structural support fordisplay 14 while minimizing mechanical stress on display 14.

Another suitable embodiment in which metal chassis 90M does not includea bent portion that wraps around light-emitting diodes 72 is shown inFIG. 15. In the example of FIG. 15, plastic chassis 90P forms at leastpart of a package for light-emitting diodes 72. Each light-emittingdiode may include a semiconductor device such as diode die 114. Diodedie 114 may be mounted on a lead frame structure such as lead framestructure 118. A wire bond such as wire bond 116 may be used toelectrically couple one of the diode's terminals to lead frame structure118. Lead frame structure 118 may extend out from packaging 90P towardssubstrate 88 on which light-emitting diode 72 is mounted. Lead framestructure 118 may be mounted to solder pad 124 on substrate 88 usingsolder 120. If desired, substrate 88 may be mounted to metal chassis 90Musing an adhesive such as adhesive 126.

Thermoplastic may be molded over diode die 114 and lead frame structures118 to form a packaging for light-emitting diodes 72 while also formingplanar surface 91 on which display layers 46 are mounted. With this typeof arrangement, the housing that packages light-emitting diodes 72 maybe integral with plastic support structure 90P that provides supportsurface 91 for display layers 46. This type of arrangement may helpminimize mechanical stress on display 14.

Another suitable embodiment in which metal chassis 90M does not includea bent portion that wraps around light-emitting diodes 72 is shown inFIG. 16. In the example of FIG. 16, plastic chassis 90P is attached tolight-emitting diode package 72P using an adhesive such as adhesive 98.Substrate 88 on which light-emitting diodes 72 are mounted may beattached to metal chassis 90M using adhesive such as adhesive 112.Adhesives 98 and 112 may be liquid adhesives, light-cured adhesives,pressure-sensitive adhesives or other suitable adhesives.

The foregoing is merely illustrative of the principles of this inventionand various modifications can be made by those skilled in the artwithout departing from the scope and spirit of the invention.

What is claimed is:
 1. An electronic device, comprising: a displayhaving a display layer; a light source configured to provide light; alight guide plate configured to receive the light and to provide thelight to the display as backlight illumination; and a plastic displaychassis on which a portion of the display layer is mounted, wherein theplastic display chassis partially surrounds the light source.
 2. Theelectronic device defined in claim 1 wherein the light source comprisesa light-emitting diode and wherein the light-emitting diode comprises asemiconductor device mounted on a lead frame structure.
 3. Theelectronic device defined in claim 2 further comprising a wire bond thatelectrically couples the semiconductor device to the lead framestructure.
 4. The electronic device defined in claim 2 wherein theplastic display chassis is molded over at least some of the lead framestructure to form a package for the light source.
 5. The electronicdevice defined in claim 2 further comprising a printed circuitsubstrate, wherein the light-emitting diode is attached to the printedcircuit substrate using solder.
 6. The electronic device defined inclaim 5 further comprising a metal display chassis, wherein the printedcircuit substrate is attached to the metal display chassis usingadhesive.
 7. The electronic device defined in claim 2, wherein thesemiconductor device and the lead frame structure are mounted in apackage for the light-emitting diode.
 8. The electronic device definedin claim 7, wherein the plastic display chassis is molded over thesemiconductor device and the lead frame structure to form the packagefor the light-emitting diode.
 9. The electronic device defined in claim7, wherein the plastic chassis comprises a bent portion that wrapsaround the package for the light-emitting diode.
 10. An electronicdevice, comprising: a liquid crystal display having opposing upper andlower polarizers, a color filter layer and a thin-film transistor layerinterposed between the upper and lower polarizers, and a layer of liquidcrystal between the color filter layer and the thin film transistorlayer; a light guide plate that provides backlight to the liquid crystaldisplay; light-emitting diodes that emit light into the light guideplate; and a metal chassis beneath the light guide plate and thelight-emitting diodes that does not wrap around the light-emittingdiodes.
 11. The electronic device defined in claim 10 furthercomprising: a plastic chassis having a bent portion that wraps aroundthe light emitting diodes, wherein the plastic chassis comprises a firstportion that is attached to the metal chassis with a first adhesivelayer and a second portion that is attached to the lower polarizer witha second adhesive layer.
 12. The electronic device defined in claim 10further comprising: a plastic chassis that is attached to and at leastpartially surrounds the light-emitting diodes.
 13. An electronic device,comprising: a display having a display layer; a light source configuredto provide light; a light guide plate configured to receive the lightand to provide the light to the display as backlight illumination; andan insert molded plastic display chassis on which a portion of thedisplay layer is mounted, wherein the insert molded plastic displaychassis is insert molded over the light source.
 14. The electronicdevice defined in claim 13 wherein the light source includes a diode diemounted within a molded package and wherein the insert molded plasticdisplay chassis is insert molded over the molded package.
 15. Theelectronic device defined in claim 13 further comprising an encapsulantformed over the light source, wherein the insert molded plastic displaychassis is insert molded over the encapsulant.
 16. The electronic devicedefined in claim 15 wherein the encapsulant comprises potting material.17. The electronic device defined in claim 13, further comprising asheet of metal, wherein the light source is interposed between theinsert molded plastic display chassis and the sheet of metal.
 18. Theelectronic device defined in claim 17, further comprising a flexiblesubstrate on which the light source is mounted.
 19. The electronicdevice defined in claim 18 wherein the flexible substrate is attached tothe sheet of metal with adhesive.
 20. The electronic device defined inclaim 19 wherein the insert molded plastic display chassis comprisespolycarbonate.